BorENide-H is a medium phosphorus Electroless Nickel(MPEN) coating with encapsulated particles of hexagonal Boron Nitride(hBN). The particles average 1 micron in size and are distributed uniformly through the deposit. The BorENide-H deposit is designed to have the characteristics of very low coefficient of friction(high slip) and low stiction(high non-stick properties).
The coating offers advantages over EN+PTFE(Teflon) in all areas excepting corrosion resistance. Because the BorENide-H solution is based on medium phosphorus EN, the corrosion resistance of the coating will be less than EN+PTFE because this coating is deposited from a high phosphorus EN(HPEN)solution. Generally, HPEN coatings are highly passive, inert and unreactive and therefore have very superior corrosion resistance compared to MPEN but this difference becomes blurred when particles are deliberately co-deposited within the coating. This is because the EN plating solutions used for this application also contains unique surfactants and dispersants. For the applications for which the BorENide-H coating isintended, corrosion resistance is not really an issue.
The advantages of BorENide-H coatings over EN+PTFE are as follows:
1/ Harder coating – approx 48 RockwellC vs approx 30 RC for EN+PTFE.
2/ Lower coefficient of friction and lower stiction compared to EN+PTFE. This has been demonstrated in practice.
3/ Melting point(mp) of the BorENide-H deposit is 880-890Celsius. The benefits of low coefficient of friction and low stiction are maintained up to the mp.
With EN+PTFE, the coating can only be subjected to a continuous temperature of 260Celsius and at 327Celsius, the PTFE begins to melt and decompose. Above 260Celsius, volatile and toxic PTFE monomers are given off.